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VOSM6490 Qualcomm QCS6490 Module
VOSM6490 Qualcomm QCS6490 Module
VOSM6490 Qualcomm QCS6490 Module
VOSM6490 Qualcomm QCS6490 Module

VOSM6490 Qualcomm QCS6490 Module

• High-performance, low-power edge AI processor
• Up to 12 TOPS NPU for efficient real‑time inference
• 2160p H.265/H.264 encoder & decoder
• 64MP@30fps ZSL camera ISP
• Rich I/O: USB, UART, SPI, GPIO, PCIe, I2C, PWM
• GbE, Wi-Fi, BT support via carrier board 
• Android and Linux systems supported
• OSM size-L (45mm x 45mm) compliant
• Extended service life (7+ years)

Description
Specifications
Resources

The VOSM6490 is a premium, ready-to-integrate System-on-Module (SoM) engineered to accelerate the development of next-generation, high-performance embedded IoT devices. The module delivers flagship-level computing, artificial intelligence, and connectivity within the compact and scalable OSM (Open Standard Module) form factor. It integrates an octa-core Kryo 670 cluster running at up to 2.7 GHz, paired with an AdrenoTM 643 GPU and a 12-TOPS HexagonTM NPU, delivering sufficient raw performance for demanding edge-AI workloads while keeping the entire module within a low-power envelope.

The VOSM6490 supports FHD+ video display, up to 64MP at 30fps camera ISP, alongside the internal HexagonTM DSP for high-quality multimedia applications. Connectivity is enabled via the carrier board, supporting dual GbE ports, Wi-Fi, and Bluetooth. A comprehensive set of I/O is exposed through the standard OSM edge connector, including USB, PCIe, GPIO, multiple serial interfaces, and audio channels, enabling flexible, high-performance industrial and commercial IoT designs.

With support for Android 15+ and Linux distributions upon request, it offers developers a streamlined path, featuring extended software support and enhanced security from the outset. The VOSM6490 is ideally suited for a wide range of demanding applications, including HMIs, machine vision systems, autonomous mobile robots, advanced digital signage, and patient monitoring devices.

Specifications
Product Name
VOSM6490 Open Standard Module (OSM)
CPU
Qualcomm QCS6490 octa-core Kryo 670 processor: 1 x A78@2.7GHz, 3 x A78@2.4GHz, 4 x A78@1.9GHz
GPU
Qualcomm Adreno 643 GPU, 812MHz, Support OpenGL ES 3.2, Vulkan 1.x, OpenCL 2.0, DX FL12
NPU
Qualcomm Hexagon 770 NPU, up to 12 Dense TOPS
Memory
8GB LPDDR5
Storage
64GB eMMC 5.1
Video processing
2160p@60 8-bit decoder for H.265/H.264/VP9 | 2160p@30 8-bit encoder for H.265/H.264
Image signal processing
Qualcomm Spectra 570L ISP | Single camera resolution: 64MP@30fps ZSL
Digital signal processing
Qualcomm Hexagon DSP, 1980 MPPS
Power input
5V/3A DC input
Operating system
Android 15+, Linux support upon request
Device management
BlueSphere MDM (Optional for Android version)
Dimensions
45mm x 45mm (OSM Size-L) | Packaging: LGA
RTC
Integrated RTC
Temperature
Operating: -20℃ ~ +60℃ | Storage: -40℃ ~ +80℃
Humidity
5%~95% RH (Non-condensing)
I/O
UFS
1 x UFS 2.2 /UFS3.1, up to 512GB (with power supply)
Display
1 x 4-Lane MIPI DSI D-PHY V1.2/C-PHY V1.0, up to 2520 x 1080 @144Hz | 1 x 4-Lane eDP1.4, up to 2520 x 1080 @144Hz
Camera
1 x 4-Lane MIPI CSI, up to 64MP@30fps ZSL
Audio
2 x I2S (support 1 x SDI, 1 x SDO)
USB
1 x USB 3.1 Type-C, dual-role 5Gbps (non-DP ALT mode) | 1 x USB 2.0 480Mbps, Host only
PCIe
1 x 2-Lane PCIe 3.0 (Support NVMe SSD, PCIe Ethernet MAC) | 1 x 1-Lane PCIe 3.0 (Support WLAN)
SDIO
1 x 4-Bit SDIO V3.0
ADC
2 x 10-Bit ADC input
SPI
3 x SPI (Support 1 x MISO, 1 x MOSI)
UART
1 x Debug UART (1.8V) | 6 x Communication UART (1.8V)
JTAG
Supported
I²C
3 x I²C
GPIO
32 x GPIO (Max.)
PWM
5 x PWM
Key Signal
1 x Power key | 1 x Volume + key | 1 x Reset/Volume - key | 1 x Home key | 1 x Force USB boot key | 1 x 2-Bit boot select switch

Resources

Docs
Products
News & Blog

VOSM6490 System-on-Module Datasheet

2/27/2026

VOSM6490 System-on-Module Datasheet

2/27/2026

VOSM6490 System-on-Module Datasheet

2/27/2026

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