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VOSM700 MTK G700 Module
VOSM700 MTK G700 Module
VOSM700 MTK G700 Module
VOSM700 MTK G700 Module

VOSM700 MTK G700 Module

• High-performance, low-power edge AI processor
• Up to 4 TOPS NPU for AI acceleration
• HiFi 5 audio DSP, 4K video CODEC
• Dual ISPs for single 32MP camera
• Rich interfaces, robust system performance
• Wi-Fi & Bluetooth integrated; RF ready
• Android and Linux Yocto support
• OSM Size-L (45mm x 45mm) compliant
• Extended service life (7+ years)

Description
Specifications
Resources

The VOSM700 system-on-module is powered by the MediaTek MT8390 chipset, featuring an octa-core high-performance CPU, an Arm Mali-G57 MC2 GPU that supports up to dual 4K display and 4K video CODEC, and a 5th-Gen NPUdelivering up to 4 TOPS of computing powerfor AI inference. The HiFi 5 audio DSP offers efficient pre-/post-processing capability for audio and video contents. The dual-camera ISP supports configurations of a single 32MP camera, operating at 30 fps.

The module boasts versatile I/O options, including PCIe 2.0, USB, and multiple UART, I2C, SPI, and GPIO connections. With support for Wi-Fi and Bluetooth connectivity, as well as a GbE MAC with TSN, it is well suited for diverse application scenarios.

VOSM700 features LGA packaging that allows for direct welding, eliminating the need for additional connectors. Furthermore, its compliance with the Open Standard Module (OSM) V1.1 standard ensures seamless integration into various products. The module is designed tosupport an extensive range of IoT applications, such as smart home, industrial automation, healthcare, and smart cities, ensuring high levels of security,robust performance, and versatile flexibility.

Specifications
Product Name
VOSM700 MTK G700 Open Standard Module (OSM)
CPU
MediaTek MT8390, Dual-core ARM Cortex-A78 (2.2GHz) + Hexa-core ARM Cortex-A55 (2.0GHz)
GPU
Arm Mali-G57 MC3 GPU, 950MHz, Supports OpenGL ES 3.2, Vulkan 1.1, OpenCL 2.2
NPU
MediaTek 5th-Gen NPU (MDLA3.0 + Tensilica VP6), 4.0 TOPS
Memory
4GB 64-bit LPDDR4x
Storage
64GB eMMC 5.1
EEPROM
2Kb (for hardware configuration information)
Wi-Fi
IEEE 802.11 a/b/g/n/ac
Bluetooth
Bluetooth 5.2
Video processing
4K @30Hz, H.265/H.264 video encoding | 4K @75Hz, H.265/H.264/VP9/AV1 video decoding
Audio DSP
Tensilica HiFi 5
Camera ISP
2 x ISP (3A, NR, AI-FD, LSC, HDR, Warp Engine); Single camera: 32MP @30fps
Input
5V/1A DC input
Operating system
Android, Linux Yocto
Device management
BlueSphere MDM (Optional for Android version)
Dimensions
45mm x 45mm (OSM Size-L) | Packaging: LGA
Temperature
Operating: -20℃ ~ +60℃, Optional: -40℃ ~ +80℃ | Storage: -40℃ ~ +80℃
Humidity
5%~95% RH (Non-condensing)
Display (Dual display support)
1 x 4-Lane MIPI DSI, up to 2K@30Hz | 1 x 4-Lane DP, up to 4K@60Hz | 1 x 2-Lane eDP, up to 2560 x 1600@60Hz | 1 x HDMI, up to 4K@60Hz
MIPI CSI
1 x 4-Lane MIPI CSI
ADC
2 x ADC
Ethernet
1 x RGMII
Audio
2 x Audio output (Support 1 x Headphone/Speaker, 1 x Speaker) | 2 x Audio input (Support dual-Mic/headphone-Mic or digital Mic)
SPI
3 x SPI
Debug UART
1 x UART for debugging (1.8V level)
Communication UART
2 x UART for communication (1.8V level)
I²S
1 x I²S
I²C
2 x I²C
PWM
2 x PWM
USB
2 x USB 2.0 OTG | 1 x USB 3.0
GPIO
33 x GPIO (Max.)
PCIe
1 x 1-Lane PCIe 2.0
SDIO
1 x 4-bit SDIO 3.0
JTAG
Supported
Key Signal
Support 1 x Recovery key, 1 x Power key, 1 x Reset key

Resources

Docs
Products
News & Blog

VOSM700 System-on-Module Datasheet

12/29/2025

VOSM700 System-on-Module Datasheet

12/29/2025

VOSM700 System-on-Module Datasheet

12/29/2025

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