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VOSM350 MTK G350 Module
VOSM350 MTK G350 Module
VOSM350 MTK G350 Module
VOSM350 MTK G350 Module

VOSM350 MTK G350 Module

• Rich interfaces, robust system performance
• Internal DSP unit, low power design
• Wi-Fi & Bluetooth integrated, RF debug ready
• Android and Linux systems supported
• Compact size, LGA packaging
• Open Standard Module (OSM) V1.1 compliant
• Extended service life (7+ years)

Description
Specifications
Documentation

Overview

VOSM350 system-on-module (SOM), powered by MediaTek G350 chipset, is a versatile solution designed for edge AI applications that require voice and vision processing. With its quad-core ARM Cortex-A53 processor, Mali-G52 GPU, VP6 APU for AI and computer vision algorithms, and a HiFi4 audio engine DSP, this module excels in handling complex multimedia and AI tasks. Compliant with Open Standard Module (OSM) V1.1, it enables seamless integration into various products with an extended service life that meets the rigorous demands of industrial customers.

Competitive Advantages

1. Powerful AI and Multimedia Performance
• Equipped with VP6 APU for advanced AI algorithms and computer vision applications.
• HiFi4 audio engine DSP for superior voice processing and recognition capabilities.

2. Rich Interfaces and Robust Performance
• Offers a comprehensive range of interfaces, making it suitable for a variety of applications.
• Low power design ensures efficient energy usage without compromising system performance.

3. Efficient Design for Industrial Applications
• Compact LGA packaging allows for direct welding, eliminating the need for additional connectors. 
• Conforms to industrial standards with an extended service life of 7+ years, ideal for demanding environments.

Application Scenarios

Customers have the option to choose between two variants that offer advanced and compact configurations. The VOSM350 system-on-module is designed to cater to a vast of application scenarios including but not limited to handheld devices, smart home appliances, industrial IoT devices, and gym instruments.

Specifications
Product Name
VOSM350 System-on-Smart Module
CPU
MTK MT8365 (G350), Quad-core ARM Cortex-A53 low-power processor, 2.0GHz (Max.)
GPU
ARM Mali-G52 GPU, 600MHz
APU
Cadence® Tensilica® VP6 processor, 700MHz at 0.825V
Memory
4GB LPDDR4 (Optional: 2GB)
Storage
32GB eMMC 5.1 (Optional: 16GB)
EEPROM
2Kb (for hardware configuration information)
PMIC
MT6390
Wi-Fi
802.11 a/b/g/n/ac
Bluetooth
Bluetooth 5.2
Video processing
1080p60, H.265/H.264/JPEG video encoder; 1080p60, H.265/H.264/VP9 video decoder
Audio DSP
Tensilica HiFi4
Input
5V/1A DC input
Operating system
Android 10+, Linux Yocto, Linux (Support by request)
Device management
BlueSphere MDM (Optional for Android version)
Dimensions
45mm x 45mm x 3.97mm (without shield); 45mm x 45mm x 5.72mm (with shield)
Temperature
Operating: -20℃ ~ +60℃ ;Storage: -30℃ ~ +70℃
Humidity
≤95% RH (Non-condensing)
Certification
CE, FCC, CCC
I/Os
Display
1 x 4-lane MIPI DSI, up to 1920 x 1080 @60Hz
MIPI CSI
1 x 4-lane MIPI CSI, 13MP @30fps
ADC
2 x ADC
RGMII (Ethernet)
1 x RMII/MII
SPI
1 x SPI
Debug UART
1 x UART for debugging (1.8V level)
Communication UART
2 x UART (TTL)
I ²S
1 x I ²S
I ²C
2 x I ²C
PWM
Supported
USB
1 x USB 2.0 OTG
GPIO
25 x GPIO (max.)
SDIO
1 x SDIO
JTAG
Supported
Documentation
VOSM350 System-on-Module  Datasheet - V2.3.pdf
VOSM350 System-on-Module Datasheet
VOSM350 Evaluation Kit  Datasheet - V1.9.pdf
VOSM350 Evaluation Kit Datasheet
VT-SBC-VOSM350-EVB Evaluation Board Datasheet - V1.5.pdf
VT-SBC-VOSM350-EVB Evaluation Board Datasheet - V1.5
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