ARM-TI
VT-TurboG8-PB
Features
◆ARM TI Cortex-A8 AM37xx low power consumption processor.
◆Processor Module with Board to Board connector.
◆On board 256MB (Optional 512MB) DDR, On board 512MB (Optional 1GB) NAND Flash.
◆Support Extended Temperature: -40°C ~ +85°C.
◆Support Linux, WinCE OS.
Support
◆ARM TI Cortex-A8 AM37xx low power consumption processor.
◆Processor Module with Board to Board connector.
◆On board 256MB (Optional 512MB) DDR, On board 512MB (Optional 1GB) NAND Flash.
◆Support Extended Temperature: -40°C ~ +85°C.
◆Support Linux, WinCE OS.
Processor | TI,DM/AM37xx(800M/1GHz) or OMAP 35xx(600/720MHz) ARM Cortex A8 Core, Floating unit, DSP Core available (DM/OMAP3x30,3x25), Power Management and IO by TPS65930 |
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On Board Memory | Flash and DDR in MCP: RAM: DDR 166MHz, 256MB ( 512MB optional); ROM: NAND Flash,512MB (1GB Optional) |
RAM | DDR 166MHz, 256MB ( 512MB optional) |
ROM | NAND Flash,512MB (1GB Optional) |
Extended Memory | 2xMMC/SD/SDHC |
Video Out | 2D/3D Accelerator available(OMAP3x30,3x15); 1xLVDS/TTL, up to 2048x2048; 1xCVBS-S/RCA AV Output; 1x24 bit DSS bus interface |
Audio | I2S Codec, MIC1/MIC2 input, Line Output R/L |
GMPC | 1xGPMC Bus |
MCBSP | 1xMCBSP Bus, up to 2xMCBSP Bus |
USB | 1xUSB2.0 Host High Speed (480Mbps); 1xUSB2.0 Client High Speed (480Mbps) |
COM Port | 3xUART (5Wires), 2xI2C, 2xSPI/SSP Interface |
IOs | 6x6 array key board, 16xGPIOs (up to 20GPIOs), 1xCamera Interface, 10bit |
RTC | Supported by TPS65930 |
OS | Supported: Linux, WinCE |
SDK | Supported |
Input | 3.3V Input, 1.8V Output |
Dimensions | 70 x 45mm |
Temperature | Operating:-20℃ ~ +70℃, (ETR:-40℃ ~ +85℃ optional), Storage: -40℃ ~ +85℃ |
Humidity | 10-85%RH (Non-Condensation), operating and storage |
Cooling Mode | Fanless |
Name | Type | Version | Release date |
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