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ARM-TI

VT-TurboG8-PB


Features

ARM TI Cortex-A8 AM37xx low power consumption processor.

Processor Module with Board to Board connector.

On board 256MB (Optional 512MB) DDR, On board 512MB (Optional 1GB) NAND Flash.

Support Extended Temperature: -40°C ~ +85°C.

Support Linux, WinCE OS.


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ARM TI Cortex-A8 AM37xx low power consumption processor.

Processor Module with Board to Board connector.

On board 256MB (Optional 512MB) DDR, On board 512MB (Optional 1GB) NAND Flash.

Support Extended Temperature: -40°C ~ +85°C.

Support Linux, WinCE OS.

Processor TI,DM/AM37xx(800M/1GHz) or OMAP 35xx(600/720MHz) ARM Cortex A8 Core, Floating unit, DSP Core available (DM/OMAP3x30,3x25), Power Management and IO by TPS65930
On Board Memory Flash and DDR in MCP: RAM: DDR 166MHz, 256MB ( 512MB optional); ROM: NAND Flash,512MB (1GB Optional)
RAM DDR 166MHz, 256MB ( 512MB optional)
ROM NAND Flash,512MB (1GB Optional)
Extended Memory 2xMMC/SD/SDHC
Video Out 2D/3D Accelerator available(OMAP3x30,3x15); 1xLVDS/TTL, up to 2048x2048; 1xCVBS-S/RCA AV Output; 1x24 bit DSS bus interface
Audio I2S Codec, MIC1/MIC2 input, Line Output R/L
GMPC 1xGPMC Bus
MCBSP 1xMCBSP Bus, up to 2xMCBSP Bus
USB 1xUSB2.0 Host High Speed (480Mbps); 1xUSB2.0 Client High Speed (480Mbps)
COM Port 3xUART (5Wires), 2xI2C, 2xSPI/SSP Interface
IOs 6x6 array key board, 16xGPIOs (up to 20GPIOs), 1xCamera Interface, 10bit
RTC Supported by TPS65930
OS Supported: Linux, WinCE
SDK Supported
Input 3.3V Input, 1.8V Output
Dimensions 70 x 45mm
Temperature Operating:-20℃ ~ +70℃, (ETR:-40℃ ~ +85℃ optional), Storage: -40℃ ~ +85℃
Humidity 10-85%RH (Non-Condensation), operating and storage
Cooling Mode Fanless

Supported documents
Name Type Version Release date

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